高分子　Vol.59　No.2　2010年2月
高分子　Vol.59　No.2
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特集　熱制御材としての高分子
グローイングポリマー　Growing Polymers: A Personal Account
独立助教の船出
The Departure of a Self-Supporting Young Researcher's Ship		 藤森　厚裕
Atsuhiro FUJIMORI
＜要旨＞I became independent to form my own laboratory. I have always practiced hard to improve my skill with the aim of becoming a professional of structural analysis for the polymer Langmuir-Blodgett films since then.
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目的と手段
Purpose and Means		 増永　啓康
Hiroyasu MASUNAGA
＜要旨＞I think it is good that I achieve my mission in academic research activities even if the purpose and means change.
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展望　COVER STORY: Highlight Reviews
高分子の熱伝導率・熱拡散率測定法と標準化
Determination of Thermal Conductivity and Thermal Diffusivity of Polymeric Materials: the Methods and the Standards		 橋本　壽正・森川　淳子
Toshimasa HASHIMOTO and Junko MORIKAWA
＜要旨＞高分子の熱伝導率・熱拡散率測定法について，国際標準（ISO）で検討された方法論を中心に解説する。現在の熱伝導率制御技術への期待と測定例を紹介し，高分子材料のような多様性に富み，かつ高次構造が複雑なものはデータベースのみでは対応できず，簡便迅速な，かつ精度のよい計測法が重要性を増すこと，普及には標準化が不可欠であることを論じる。
Keywords: Thermal Conductivity / Thermal Diffusivity / Temperature Wave Analysis / Aromatic Polyimide / Poly (methylmethacrylate) / ISO
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強磁場配向による高分子の異方性高次構造制御と高熱伝導化
High Thermal Conductive Polymer Prepared in a Magnetic Field		 木村　亨・下山　直之・青木　恒
Tohru KIMURA, Naoyuki SHIMOYAMA, and Hisashi AOKI
＜要旨＞液晶性高分子に強磁場を印加させると，分子鎖（フィブリル）を任意の方向に配向させることが可能であり，こうして得られた異方性の高分子は熱的，機械的にも非常に興味深い材料となる。本稿では，超電導マグネットを用いてさまざまな特徴をもつ高分子の分子鎖を配向させることにより，高分子材料が高熱伝導化された結果について概説する。
Keywords: Thermal Conductivity / Magnetic Field / Anisotropic / Liquid Crystalline Polymer
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絶縁エポキシ樹脂のランダム自己配列型高次構造制御による高熱伝導化
High Thermal Conductive Epoxy Resin with Controlled Higher Order Structures		 竹澤　由高
Yoshitaka TAKEZAWA
＜要旨＞絶縁材料の熱伝導の媒体であるフォノン散乱を抑制できる秩序性の高い高次構造を樹脂内部に効果的に形成させるため，自己配列型のメソゲン骨格をエポキシ樹脂分子内に導入し，熱伝導率を飛躍的に高めた絶縁樹脂を開発した。その材料設計の考え方，並びに高熱伝導性発現の源となる高次構造観察結果について説明する。
Keywords: Epoxy Resin / Thermal Conductivity / Mesogen / Phonon / Orientation / Domain / Insulation
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トピックス　COVER STORY: Topics and Products
熱伝導率測定装置の進歩
Development of New Thermal Conductivity Measurement Systems		 遠藤　聡
Satoshi ENDO
＜要旨＞Ulvac-Riko, Inc. has developed new thermal conductivity measurement systems based on various kinds of steady method, temperature wave analysis method, flash method, scanning laser heating AC method, periodic heating thermoreflectance method, and so on. Here, we introduce new thermal conductivity and diffusivity meters made by Ulvac-Riko, Inc.
Keywords: Thermal Conductivity / Thermal Diffusivity / Steady Method / Flash Method / Temperature Wave Method / Scanning Laser Heating AC Method / Periodic Heating Thermoreflectance Method
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高熱伝導性炭素繊維Raheama® とその使用法
High Heat Conductive Milled Carbon Fiber “Raheama” and Its Application		 佐野　弘樹
Hiroki SANO
＜要旨＞“Raheama” is a highly graphitized carbon fiber. “Raheama” has two features for the heat conductive compound design. One is high heat conductivity, another is suitable shape for forming thermal transport channels.
Keywords: Heat Conductivity / Carbon Fiber / Graphite
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封止・接着用高熱伝導・電気絶縁性液状エポキシ材料リコ・ジーマ・イナス

RICO-Zima-inus, Thermally Conductive and Electrically Insulating Epoxy Resin Compound		 小堺規行・白石哲也・西畑　武
Noriyuki KOZAKAI, Tetsuya SHIRAISHI, and Takeshi NISHIHATA
＜要旨＞RICO-Zima-inus is the one package epoxy resin compound with high thermal conductivity and electric insulation. The thermal conductivity is up to 40 times higher (=1〜7.3 W/Km) than an ordinary epoxy resin, even though electronic insulating is kept. This compound includes the group of unique inorganic mineral particles in order to compose a thermal conductive structure.
Keywords: Epoxy Resin / Heat Conductivity / Electric Insulation / Inorganic Particle
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熱放散性成形材料スミコン®
Heat Dissipating Molding Compounds SUMIKON®		 北川　和哉
Kazuya KITAGAWA
＜要旨＞“SUMIKON® ” thermoplastic/thermoset molding compounds with heat dissipating characteristics are introduced. Heat dissipation of component part molded from SUMIKON® is also shown to be effective in heat decrease for various devices.
Keywords: Heat Dissipation / Resin Molding Compound / Thermoset / Thermoplastic / Phenolic Resin / Polyphenylenesulfide
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フェーズチェンジタイプ放熱スペーサー
Phase Change Sheet Type Thermally Conductive Spacer		 山縣　利貴
Toshitaka YAMAGATA
＜要旨＞A phase change sheet type high thermally conductive spacer, PCA-E5, was developed. The value of thermal conductivity was increased from 3.0 W/mK to 3.8 W/mK with a small size thermally conductive filler and a high flow matrix resin.
Keywords: Phase Change Sheet / Thermal Conductivity
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新規非シリコーン系熱伝導性RTV エラストマー
New Non-Silicone Type Thermally Conductive RTV (Room Temperature Vulcanizing) Elastomers		 川井　秀紀
Hideki KAWAI
＜要旨＞New Non-Silicone type Thermally Conductive RTV elastomers have been developed.
These new RTV elastomers consist of Kaneka original non-silicone type reactive oligomers and thermally conductive fillers. These new elastomers show high thermal conductivity and electrical resistivity. They are curable by moisture in the atmosphere at room temperature.
Keywords: Non-Silicone RTV Elastomer / Thermal Conductivity / Thermal Interface Material
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環境に優しい断熱発泡シート
Eco-Friendly Thermal Insulating Foam Sheet		 末岡　雅則
Masanori SUEOKA
＜要旨＞We have developed Non-Freon thermal insulating foam sheet with excellent insulation properties and durability by combining of innovative foaming technology and gas barrier technology. According to our simulation, it can maintain thermal conductivity of 0.023 W/mK over 20 years.
Keywords: Thermal Insulation / Thermal Conductivity / Foam Sheet / Gas Barrier
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高分子科学最近の進歩　Front-Line Polymer Science
ブロックコポリマーテンプレート工学
Block Copolymer Template Engineering		 彌田　智一・渡邉　亮子
Tomokazu IYODA and Ryoko WATANABE
＜要旨＞A new wave is surging on a long history of microphase-separated nanostructures in block copolymers as the self-assembled nanostructures leading to industrial use as the new engineered plastics. Emphasis should be placed on both high reproducibility and mass production of these ordered nanostructures through self-assembling nanofabrication processes, expected as one of the powerful counterparts of the top-down-type nanofabrication such as lithography and beam processing. Here, recent progress of block copolymer lithography including dry etching process toward the next generation semiconductor process is briefly reviewed. Our approach based on total wet process using amphiphilic liquid crystalline block copolymer films equipped with fully penetrated transport channels is also introduced.
Keywords: Block Copolymer / Lithography / Nanopatterning / Bottom-up Technology / Microphase Separation / Template / Self-assembly / Ordered Nanostructures
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