| POLYMERS Vol.67 No.8 |
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COVER STORY
It is Tough Being a Polymer: Thermal Stability and Endurance |
| COVER STORY: Highlight Reviews |
| Asymmetric Styrene Block Copolymer has High Elasticity and High Modulus as Elastic Materials | Sadaharu HASHIMOTO |
| <Abstract> Conventional symmetric styrene block copolymer forms sphere, cylinder and lamellar according to styrene content as micro segregated structures. Introducing asymmetric styrene structure gives sphere morphology with high styrene content in the styrene block copolymer. High styrene content contributes high modulus, and sphere morphology gives high elasticity and low hysteresis. Certain ratio of asymmetric styrene copolymer and symmetric copolymer achieves the unique morphology. These two different copolymers can be produced in the same reactor (in-situ polymerization) by living anionic polymerization. We can control precise ratio of asymmetric and symmetric styrene isoprene block copolymers for hygiene elastic materials. We can controll the morphology by this technology, but in the future, It requires more and more severe performances (heat resistance, durability, impact performance) for block polymers. We introduce new technology and future outlook. Keywords: Styrene Block Copolymer / Living Anionic Polymerization / Asymmetric / Elastic Material / Sphere Morphology |
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| High-Heat Resistant Biomass Polymer Film | Shigeki UEHIRA, Toshihide YOSHITANI |
| <Abstract> As there are growing demands for a low carbon society and resource recycling society, materials using biomass have been developed. For example, polylactic acid is already put into practical use and isosorbide polycarbonate and polyethylene furanorate are used utilizing their properties. In this paper, we wish to describe our development of new polymers using raw material derived from rosin. Keywords: Biomass Polymer / Raw Materials for Non-Edible Plants / High Heat Resistance / Dehydroabietic Acid |
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| Application Development of Syndiotactic Polystyrene Resin (SPS) | Naoto OKUBO |
| <Abstract> We developed an application of a polymer to contribute to the improvement of social and individual comfort whilst reducing and preferably inhibiting environmental impact with syndiotactic polystyrene resin which is an engineering plastics originating in Japan. We have developed SPS chopsticks with low environmental impact as an alternative to wooden chopsticks and an SPS printed circuit boards (PCBs) connector suitable for lead-free solder. Keywords: Syndiotactic Polystyrene / Engineering Plastic / Appliances / Daily Necessities / Automotive |
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| COVER STORY: Topics and Products |
| The Low Molecular Weight Polyarylate Resin as Epoxy Curing agent | Takatoshi MURAKAMI |
| <Abstract> The low molecular weight polyarylate resin “UNIFINERTM” has been developed as epoxy curing agent. It has 3 key properties. First, it is possible to achieve higher heat resistance, lower dielectric constant and lower dielectric loss tangent of the epoxy resin. The phenolic end group type improves heat resistance of the epoxy resin, and the end-capped group type improves the dielectric properties of the epoxy resin. Second, it has reactivity with the epoxy resin. In the polyarylate region, not only the terminal phenol groups but also the ester bonds in the main chain reacts with the epoxy group of the main resin. Finally, it is soluble in general purpose solvents such as methyl ethyl ketone or toluene. The low molecular weight polyarylate resin is suitable for PCB material, CFRP prepreg, sealant and various applications. Keywords: Polyarylate Resin / Epoxy Curing Agent |
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| Polyimide Film for 2-Layer FCCL PIXEO BP | Hitoshi NOJIRI |
| <Abstract> Compared to 3-layer FPC boards using epoxy type adhesive, 2-layer FPC boards are more reliable and have greater dimensional stability. PIXEO BP is a polyimide film that has adhesive layers of thermoplastic polyimide on either side of the core polyimide film and is used in 2-layer FPC boards. PIXEO BP is supported by three unique technologies. 1. The molecular design of the core polyimide and thermoplastic polyimide. 2. The coextrusion technology for two different polyimide precursors in a chemical cure process. 3. The lamination technology for polyimide and copper. Keywords: Polyimide / Thermoplastic / 2-Layer Flexible Printed Circuit Board / Molecular Design / Coextrusion Technology / Lamination Technology |
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| High Performance Polyphenylene Sulfide with Heat Resistance, Chemical Resistance and Self Extinguishing Property | Yohei YAMAGUCHI |
| <Abstract> Polyphenylene Sulfide (PPS) is one of super engineering plastics and has high heat resistance, chemical resistance and self extinguishing property. Utilizing its features, it is used as a metal substitute material in various fields. In this paper, we will introduce the recent research and development of PPS in DIC focusing on long-term durability, adhesiveness which is demanded by metal substitute. Keywords: Polyphenylene Sulfide / PPS / Metal Substitute / Long-Term Durability / Adhesiveness |
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| Polymer Science and I: A Personal Account |
| Learning from Failure | Shinsuke ISHIHARA |
| <Abstract> My experinces learning from failure in school days and postdoc career have been described in this column. Important message is that failure make researchers more mature. |
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| Front-Line Polymer Science |
| Supramolecular Materials Constructed by Peptide Self-Assembly | Kazunori MATSUURA |
| <Abstract> This review article describes recent progress in chemical strategies to design artificial peptide assemblies. Trigonal peptide conjugates were developed to construct virus-like peptide nanocapsules. Self-assembly of β-annulus peptide derived from tomato bushy stunt virus afforded artificial viral capsids, which can encapsulate and be modified with various molecules. Spatiotemporal control of peptide nanofibre growth was also achieved by photocleavage of a DNA-conjugated β-sheet forming peptide, which was applied to photoinduced propeling of liposome. Keywords: Self-Assembly / Supramolecular Material / Trigonal Peptide Conjugate / β-Annulus Peptide / Artificial Viral Capsid / Photocleavage |
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