高分子 Vol.65 No.10
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特集 粘・接着剤と高分子
展望 COVER STORY: Highlight Reviews
高分子の表面・界面と粘・接着:Interphase
Adhesion and Polymer Surface / Interphase
西野 孝
Takashi NISHINO
<要旨>粘・接着を知るためには、被着体、粘/接着剤表面と界面の構造・物性を個々に、そして総合して理解する必要がある。ここでは、粘・接着にかかる高分子の表面、界面の特異な構造・物性の解析例を紹介し、原理、手法を異にする複数の解析手法を組み合わせることで、界面を三次元で界面層(interphase)として捉えることの重要性と展開について述べる。
Keywords: Adhesion / Interphase / Surface / Nano-Analysis / Poly-α-Olefin / Weak Boundary Layer / X-ray Diffraction
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粘・接着剤に用いられる高分子材料の開発動向
Activities of Polymer Materials for Adhesives
杉崎 俊夫
Toshio SUGIZAKI
<要旨> 接着技術は生活と産業のあらゆる分野で重要な役割を果たしており、自動車産業、建築産業そして次世代パワーデバイスなどのエレクトロニクス産業等に大きく貢献しています。本報では、合成・重合・解析における具体的な研究内容を参考に、次世代パワーデバイスへの用途や、生物由来の接着への応用技術、バイオマスプラスチック系接着剤への期待を紹介します。
Keywords: Adhesive / Devices / Biological / Biomass / Polymerization
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木材用天然系接着剤の開発動向
Research & Development of Natural Adhesives for Wood
梅村 研二
Kenji UMEMURA
<要旨> 木材接着分野では、最近、非化石資源を利用した天然系接着剤の開発が注目されている。これまでの開発手法は、天然物の特性や調製方法によって四つに大別され、さまざまな天然物を用いた接着剤が提案されている。本稿では多糖類系、タンパク系、フェノール系接着剤の最近の開発動向を紹介するとともに今後の課題について述べる。
Keywords: Natural Adhesives / Wood / Wood-Based Materials / Polysaccharide Based Adhesives / Protein Based Adhesives / Aromatic Based Adhesives / Development Methodology
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トピックス COVER STORY: Topics and Products
解体性接着剤
Dismantlable Adhesive
佐藤 千明
Chiaki SATO
<要旨> The recent progress on dismantlable adhesive is reviewed in this article. For recycling of materials, a type of adhesive, which can be separated on demand, has been applied to the joining. The type of adhesive is called dismantlable adhesive. In order to realize such an adhesive, several special techniques have been applied to the adhesives such that inclusion of blowing agents or thermally expandable microcapsules. In addition, other techniques such as taking advantage of chemical degradation have recently been proposed.
Keywords: Dismantlable Adhesive / Recycling / Blowing Agents / Chemical Reaction / Thermally Expandable Microcapsules / Multimaterial Structures
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反応性アクリル系ポリマーの設計と粘着型の易解体性接着材料への応用
Design of Reactive Acrylic Polymers and Their Application to Pressure-Sensitive Type Dismantlable Adhesives
佐藤 絵理子・松本 章一
Eriko SATO, Akikazu MATSUMOTO
<要旨> Dismantlable adhesives require strong bonding with durability in use and easy debonding on demand. In order to satisfy the contradicting properties, we designed reactive acrylic copolymers and investigated their application to pressure-sensitive type dismantlable adhesives, in terms of the reduction in peel strengths, the achievement of interfacial failures, and quick dismantling. Reactive acrylic copolymers containing gas generating units and cross-linkable units resulted in significant reduction in the peel strength in response to heating in the presence of acid catalysts due to a decrease in the effective bonding area and an excess increase in modulus. Different failure modes were observed by changing morphology and the balance between gas generation and cross-linking. Acrylic copolymers containing hemiacetal esters achieved spontaneous debonding with both interfacial failures between adhesive layer, a metal adherend, and a support polymer film by simply soaking in boiling water. Precise polymer synthesis and the reaction control are shown to be effective for the design of high performance dismantlable adhesive materials.
Keywords: Acrylic Copolymer / Pressure-Sensitive Adhesive / Dismantlable Adhesive / Gas Evolution / Cross-Linking / Failure Mode
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高分子複合材料におけるグラフェンの居場所
Favorable Place for Graphene Sheets in Polymer Composites
永田 謙二・屠 策
Kenji NAGATA, Ce TU
<要旨> Electrically conductive polymer composites have numerous potential applications in high-voltage networks, charge dissipation, and reflective surfaces. Graphene has been shown to be an ideal component in many polymer composites. However, dispersion of graphene into non-polar polymers such as polyolefins has been difficult. Moreover, selective localization of the conductive component in the composites is critical. In this work, we prepared electrically conductive composites of graphene with polyethylene (PE) and polypropylene (PP) via melt compounding, and optimized the microstructure and electrical properties. Optimization of the processing conditions was found to significantly increase the amount of SEG located at the blend interface, resulting in an electrical conductivity of as high as 1.86 x 10-5 S/m at only 1 wt% SEG.
Keywords: Graphene / Polymer Blend / Processing Sequence / Electrical Percolation Threshold / Selective Localization
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グローイングポリマー Polymer Science and I: A Personal Account
環境を変えて見えてくること
Make Change in the Environment
鈴木 悠
Yu SUZUKI
<要旨> The changing environments brought me new perspectives and great encounters, and they saved my research life in various scenes. I would like to continue working with caring about new encounters and without a fear of change.
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高分子科学最近の進歩 Front-Line Polymer Science
ポリシルセスキオキサンの機能を活かした有機無機ハイブリッド材料
Organic-Inorganic Hybrid Materials Utilizing Functions of Polysilsesquioxanes
松川 公洋・渡瀬 星児
Kimihiro MATSUKAWA, Seiji WATASE
<要旨> Polysilsesquioxanes can be synthesized by a sol-gel method using the trialkoxysilane having an organic functional group on the silicon atom. As well-known the purified silsesquioxane of polyhedral cage and ladder structure, but they are disadvantage for the practical use by the high price. On the other hand, the random-type polysilsesquioxanes can be produced with relatively low cost that is prepared by simple sol-gel method, so we are interested in the functional organic-inorganic hybrids using the random-type polysilsesquioxanes. This paper describes about their application of novel random-type polysilsesquioxanes. Polymethylsilsesquioxanes and related compounds could be applied for the gate insulator of organic TFT devices. It was found that several functional groups provided specific properties. As polysilsesquioxanes prepared from carbazole-containing trialkoxysilane showed the characteristic of p-type semiconductor, their p-n junction device has a excellent function of rectifier. Thiol-containing polysilsesquioxanes generated the crosslinking hybrids by the thiol-ene reaction with multi-allyl compounds. These organic-inorganic hybrids showed the properties of flexible and self-healing.
Keywords: Polysilsesquioxanes / Organic-Inorganic Hybrids / Organic TFT / Gate Insulator / Semiconductor / Rectifier / Thiol-Ene Reaction
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