高分子 Vol.67 No.9
>> Japanese >> English
特集 電子機器を支える高分子
展望 COVER STORY: Highlight Reviews
Toward Realization of Next-Genration Patterning with Directed Self-Assembly
吉元 健治
<要旨> 電子機器のさらに小型化・高性能化を進めるためには、近い将来、最小ハーフピッチが10 nm以下の半導体集積回路を量産する新技術が必要となる。その候補の一つとして、ブロック共重合体のミクロ相分離を利用した誘導自己組織化器(DSA)が注目されている。DSAとは何か? また、DSAの最適化には不可欠なシミュレーションについて概説する。
Keywords: Directed Self-Assembly / Lithography / Micro/Nano Fabrication / Block Copolymer
Simulation of Polymer Resist Film
柳生 裕聖
Hiromasa YAGYU
<要旨> 電子機器やMEMS(Micro Electro Mechanical Systems)の製造プロセスではレジストを用いたフォトリソグラフィー加工が必要となる。レジストはフォトリソグラフィー加工の基盤となる高分子材料であり、プロセスの最適化やパターンの高精度化を実現するためには、シミュレーション技術が重要となる。本稿では高分子レジスト膜のシミュレーション技術について、最近の研究例と筆者が検討しているMEMS用レジストのモデル化手法を解説する。
Keywords: Photolithography / MEMS / Molecular Dynamics / Photoresist / Exposure / Development
トピックス COVER STORY: Topics and Products
Flexible Print Cable of Porous Polyimide Film
瀧 健太郎
Kentaro TAKI
<要旨> Porous polyimide film is a promising substrate for high-frequency data transmission owing to its low dielectric constant and low attenuation of signal. This paper reviews a series of studies about the production of porous polyimide film and subsequent attempts of production of flexible print cables. The porous polyimide film was created by newly developed zwitterion-induced phase separation of tertiary amine methacrylate and high-pressure CO2 and subsequent UV-induced photopolymerization. This process forms uniform porous structures and is applied to create the flexible print cables.
Keywords: Porous Polyimide / Flexible Print Cable
Evaluation and Analysis of Resin Shrinkage for PKG Substrate Warpage
安部 慎一郎
Shinichiro ABE
<要旨> Market of portable device has been growing. With the miniaturizing of mobile device as smart-phones and tablet PCs, semiconductor packages are demanded to be thinner and higher in density. However, thinner PKG tends to warp at the assembly process and cause the decrease in the connection reliability. Therefore core materials with low CTE(coefficient of thermal expansion) and high elastic modulus have been needed as a key solution for the reduction of the warpage for thinner PKG. We have newly developed core materials by reducing the resin shrinkage. In this paper, we reported analyzing the shrinkage mechanism and resin design.
Keywords: Package / Shrinkage / Warpage / Simulation / Solubility
LCD and Alignment Film
杉山 文隆・吉澤 純司
<要旨> Liquid crystal displays (LCD) are used in TV, mobile device, PC, and etc. Many kind of polymer materials are used in LCDs. An alignment film that controls the direction of the liquid crystal (LC) is an essential material for high resolution, high transmittance, and low power consumption. A variety of properties such as anchoring the energy of the LC, inducement of the LC pretilt angle, voltage holding ratio, heat resistance, formation of thin film, and etc. are required in the alignment film. LCDs were, originally, commercialized with Twisted Nematic (TN) mode that fabric roll rubbs surface of alignment film to realize homogeneos alignment. As a second generation, in-plane switching (IPS) mode and vertical alignment (VA) mode are comercialized to overcome narrow viewing angle of TN mode. However, higher transmittance is still required for high quality LCDs. Photo alignment is a new technique for high transmittance to enable alignment of LCs by polarized ultra-violet (UV) exposure, and has been widely applied in both IPS and VA mode.
Keywords: Liquid Crystal / Display / Alignment Film / Polyimide / Photo Reaction
Mold Release Films of Semiconductors
小寺 省吾・八百板 隆俊
Seigo KOTERA, Takatoshi YAOITA
<要旨> We introduce encapsulating technique using mold release films for semiconductor devices which grow more than ever in the IoT era. Methods of the encapsulation by epoxy molding compounds (EMC) are divided into two main types, such as transfer and compression moldings. Taking advantage of its low-stress process, the compression molding plays a key role especially in memory market. Release films must combine easy release from the molded EMC and adequate flexibility to follow the shape of the mold. Ethylene-tetrafluoroethylene (ETFE) copolymer film is a best example which is able to satisfy both of above requirements even at high temperature. Typical data of those properties between ETFE and polyester films are shortly presented.
Keywords: Release Film / Encapsulation / Molding / Semiconductor / Epoxy Molding Compounds (EMC) / Ethylene-Tetrafluoroethylene (ETFE)
グローイングポリマー Polymer Science and I: A Personal Account
New Discoveries in Existing Fields
森岡 孝至
<要旨> This short essay describes what I am keeping in mind about research from the experience, and the reason I became a researcher. We cannot always explore new fields of research. Even in known fields, I believe that new discoveries are possible, and I will be working on such research.
高分子科学最近の進歩 Front-Line Polymer Science
Control of the Crystalline Structure of Poly(vinilydene fluoride) (PVDF)
堀邊 英夫
<要旨> We obtained PVDF (form Ⅰ) by heat treatment at 185 and 190℃ after blending PVDF/PMMA 70/30 wt%(F70). The samples produced under other heat treatment and blend ratio conditions indicated PVDF (form Ⅱ). Results of DSC, polarized light micrography and light transmittance indicated that F70 heat-treated at 185 and 190℃ exhibited high compatibility between PVDF and PMMA. In contrast, PVDF (form Ⅱ) samples obtained in other conditions indicated lower compatibility. The PVDF crystalline structure of the original starting material changed into the structure of the PVDF (form Ⅰ) according to decrease of the crystallization rate by the highest compatibility. We quantified the solvent evaporation rate in the production of three PVDF crystalline structures using the solvent casting method. The results indicated that the crystalline structures of forms Ⅰ, Ⅱ and Ⅲ of PVDF were obtained when the solvent evaporation rates were <0.0001, >0.28 and between 0.02 and 0.03 g/min, respectively. It was established that the crystalline structure of PVDF from solvent casting is predominantly determined by the solvent evaporation rate.
Keywords: Crystalline Structure of PVDF / PVDF/PMMA / Compatibility / Heat Treatment / Residual Solvent / Dipole Moment Solvent / Solvent Evaporation Rate