| POLYMERS Vol.70 No.6 |
| >> Japanese |
COVER STORY 5G! Gather Round, Everyone |
| 5th generation mobile communications system (5G) services have become widespread lately. This is the beginning of the era of high-speed, high-capacity communications. 5G uses high-frequency signals such as millimeter-wave bands to achieve high-speed, high-capacity communications. However, conventional materials have the problem that signal transmission loss increases due to dielectric loss and conductor loss. Another problem is that heat generation increases as the amount of data processed increases. In this issue, we will focus on materials and technologies that resolve these problems and pave the way for a new era. Editors: MATSUOKA, IWASAKI, KAMATA, and SHISHIDO |
| Digest for English Readers | 296
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| Hot Topics in Polymer Science in SPSJ | 299
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| SPSJ PMF Poster Awards 2020 |
| Commentary |
| Newly Developed FPC Materials for 5G/6G | Hirofumi MATSUMOTO | 300
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| COVER STORY: Highlight Reviews |
| Interlayer Dielectrics for Printed-Wiring Boards: Thermosetting Resin | Mitsuru UEDA | 301 |
| LCP Materials for 5G Application | Akihiro NAGAE | 304 |
| PolyMANGA | 307 |
| COVER STORY: Topics and Products |
| Polymer Science and I: A Personal Account |
| My Apology and Appreciation to the Society of Polymer Science, Japan | Yosuke NIKO | 318
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| Messages: “Work and Life” |
| 40 Years Old in Suffering | Akiko OKAMOTO | 319
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| Front-Line Polymer Science |
| Photo-Reworkable Adhesives and Photoresponsive Pressure-Sensitive Adhesives | Takahiro YAMAMOTO | 320
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| Messages from SPSJ | 325 |
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