POLYMERS@Vol.60@No.3
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COVER STORY
Polymers Pushing the Limits of Semiconductors
The progress of highly integrated and high-speed semiconductor circuits has been following Moorefs law, by which the number of components in an integrated circuit doubles every two years. This has been achieved not only through the progress of silicon transistor design but also thanks to the development of polymers which play an important role in realizing the desired performance. This issue focuses on polymeric materials used for next-generation electronic device fabrication and introduces the latest technology.
iEditors: MIKOSHIBA, SEKI, NAKAGAWA, and VACHAj
Hot Topics
115

Commentary
Expectation of Polymer Materials Innovation Hisatsune WATANABE
117

COVER STORY: Highlight Reviews
Photoresists for Microlithography Mitsuru UEDA

118

Development of Extreme Ultraviolet Resist Materials Hiroto KUDO and Tadatomi NISHIKUBO

122

Directed Self-Assembly of Block Copolymers for Lithographic Applications Hiroshi YOSHIDA

126

UV Nanoimprint Hiroshi HIROSHIMA

130


Glossary for Highlight Reviews
134

COVER STORY:Topics and Products
Resist Materials for ArF Immersion Lithography Koji NOZAKI

135

Progress of Mask-Blanks and Nanoimprint Mold Development for Hard Disk Drive Application Tsuyoshi WATANABE and Osamu NAGAREKAWA

137

Fluorescent Resist Materials for Nanoimprint Lithography Masaru NAKAGAWA

139

Electron Beam Resists Takumi UENO

141

Recent Topics in Resist Development Used for Extreme Ultraviolet Lithography Takahiro KOZAWA

143


Growing Polymers: A Personal Account
Enjoy Conferences ! Akihiro KISHIMURA

145

Personal Connections Lead to a Treasure Trove of Researches Keita KUROIWA

146


Messages: “Work and Life”
What Do We Work for ? Tsuneaki TANABE
147

Front-Line Polymer Science
Polymer Structure and Physical Properties at Non-Solvent Interfaces Keiji TANAKA and Yoshihisa FUJII
148

Messages from SPSJ
153
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