| POLYMERS Vol.59 No.2 |
| >> Japanese | >> English | >> Korean | >> Chinese |
|
COVER STORY
Thermal Management Polymer |
| Growing Polymers: A Personal Account |
| The Departure of a Self-Supporting Young Researcher’s Ship | Atsuhiro FUJIMORI |
| <Abstract>I became independent to form my own laboratory. I have always practiced hard to improve my skill with the aim of becoming a professional of structural analysis for the polymer Langmuir-Blodgett films since then. |
| Top of the Page▲ |
| Purpose and Means | Hiroyasu MASUNAGA |
| <Abstract>I think it is good that I achieve my mission in academic research activities even if the purpose and means change. |
| Top of the Page▲ |
| COVER STORY: Highlight Reviews |
| Determination of Thermal Conductivity and Thermal Diffusivity of Polymeric Materials: the Methods and the Standards | Toshimasa HASHIMOTO and Junko MORIKAWA |
| <Abstract>This review provides a broad overview of the methods for the determination
of thermal conductivity and thermal diffusivity of polymeric materials.
Different techniques are available for these measurements and some may
be better suited than others for a particular type, state and form of material. ISO (the International Organization for Standardization) is a worldwide federation of national standards bodies. Draft International Standards adopted by the technical committees are circulated to the member bodies for voting. ISO22007, “Plastics - Determination of thermal conductivity and thermal diffusivity”, has been issued by a majority of votes in ISO/TC61, a technical committee for the plastic industry. The results of round robin testing of poly(methylmethacrylate) give the information on the sample geometry and the suitable methods. Thermal diffusivity of aromatic polyimide thin films is examined in relation with the number of phenylene units in dianhydride by using the temperature wave analysis. Keywords: Thermal Conductivity / Thermal Diffusivity / Temperature Wave Analysis / Aromatic Polyimide / Poly (methylmethacrylate) / ISO |
| Top of the Page▲ |
| High Thermal Conductive Polymer Prepared in a Magnetic Field | Tohru KIMURA, Naoyuki SHIMOYAMA, and Hisashi AOKI |
| <Abstract>As a result of the development of recent superconductive technology, a
high magnetic field can be easily utilized, and the behavior of diamagnetic
material and paramagnetic material in a high magnetic field are actively
studied. It is known that the thermotropic liquid crystalline polymer is
oriented in the magnetic field. The oriented polymer has high thermal conductivity
and low coefficient of linear expansion in the direction of a magnetic
field. It reaches 8 times higher thermal conductivity than a conventional
polymer. It is also possible to align the network structure of liquid crystalline
epoxy resin by a high magnetic field. The curing epoxy resin has various
anisotropic properties under a magnetic field. We succeeded in improving
the thermal conductivity over 10W/m・K at certain plastic film using a high
magnetic field. Keywords: Thermal Conductivity / Magnetic Field / Anisotropic / Liquid Crystalline Polymer |
| Top of the Page▲ |
| High Thermal Conductive Epoxy Resin with Controlled Higher Order Structures | Yoshitaka TAKEZAWA |
| <Abstract> We developed novel epoxy resins with increased thermal conductivity that
has been a barrier to heat dissipation. The medium of thermal conduction
for insulating resins is phonons. Phonon conduction depends on the crystallinity,
since it is a lattice vibration. The scattering of phonons happens at the
interface of an amorphous structure. If there is a macroscopic amorphous
structure despite the existence of crystal structure on the microscopic
level, we expected that high thermal conduction could be attained by reduced
scattering of phonons through controlling the nano scale structure. Using
an epoxy resin which has the mesogen structure would solve this problem
because it's easy to carry out an orientation with this structure. As a
result, we confirmed that thermal conductivities get larger when the amounts
of mesogens were increased. The conductivity of the developed epoxy resin
was about five times higher than that of the conventional epoxy resin. Keywords: Epoxy Resin / Thermal Conductivity / Mesogen / Phonon / Orientation / Domain / Insulation |
| Top of the Page▲ |
| COVER STORY: Topics and Products |
| Development of New Thermal Conductivity Measurement Systems | Satoshi ENDO |
| <Abstract>Ulvac-Riko, Inc. has developed new thermal conductivity measurement systems
based on various kinds of steady method, temperature wave analysis method,
flash method, scanning laser heating AC method, periodic heating thermoreflectance
method, and so on. Here, we introduce new thermal conductivity and diffusivity
meters made by Ulvac-Riko, Inc. Keywords: Thermal Conductivity / Thermal Diffusivity / Steady Method / Flash Method / Temperature Wave Method / Scanning Laser Heating AC Method / Periodic Heating Thermoreflectance Method |
| Top of the Page▲ |
| High Heat Conductive Milled Carbon Fiber “Raheama” and Its Application | Hiroki SANO |
| <Abstract>“Raheama” is a highly graphitized carbon fiber. “Raheama” has two features
for the heat conductive compound design. One is high heat conductivity,
another is suitable shape for forming thermal transport channels. Keywords: Heat Conductivity / Carbon Fiber / Graphite |
| Top of the Page▲ |
| RICO-Zima-inus, Thermally Conductive and Electrically Insulating Epoxy Resin Compound | Noriyuki KOZAKAI, Tetsuya SHIRAISHI, and Takeshi NISHIHATA |
| <Abstract>RICO-Zima-inus is the one package epoxy resin compound with high thermal
conductivity and electric insulation. The thermal conductivity is up to
40 times higher (=1～7.3 W/Km) than an ordinary epoxy resin, even though
electronic insulating is kept. This compound includes the group of unique
inorganic mineral particles in order to compose a thermal conductive structure. Keywords: Epoxy Resin / Heat Conductivity / Electric Insulation / Inorganic Particle |
| Top of the Page▲ |
| Heat Dissipating Molding Compounds SUMIKON® | Kazuya KITAGAWA |
| <Abstract>“SUMIKON® ” thermoplastic/thermoset molding compounds with heat dissipating characteristics
are introduced. Heat dissipation of component part molded from SUMIKON® is also shown to be effective in heat decrease for various devices. Keywords: Heat Dissipation / Resin Molding Compound / Thermoset / Thermoplastic / Phenolic Resin / Polyphenylenesulfide |
| Top of the Page▲ |
| Phase Change Sheet Type Thermally Conductive Spacer | Toshitaka YAMAGATA |
| <Abstract>A phase change sheet type high thermally conductive spacer, PCA-E5, was
developed. The value of thermal conductivity was increased from 3.0 W/mK
to 3.8 W/mK with a small size thermally conductive filler and a high flow
matrix resin. Keywords: Phase Change Sheet / Thermal Conductivity |
| Top of the Page▲ |
| New Non-Silicone Type Thermally Conductive RTV (Room Temperature Vulcanizing) Elastomers | Hideki KAWAI |
| <Abstract>New Non-Silicone type Thermally Conductive RTV elastomers have been developed. These new RTV elastomers consist of Kaneka original non-silicone type reactive oligomers and thermally conductive fillers. These new elastomers show high thermal conductivity and electrical resistivity. They are curable by moisture in the atmosphere at room temperature. Keywords: Non-Silicone RTV Elastomer / Thermal Conductivity / Thermal Interface Material |
| Top of the Page▲ |
| Eco-Friendly Thermal Insulating Foam Sheet | Masanori SUEOKA |
| <Abstract>We have developed Non-Freon thermal insulating foam sheet with excellent
insulation properties and durability by combining of innovative foaming
technology and gas barrier technology. According to our simulation, it
can maintain thermal conductivity of 0.023 W/mK over 20 years. Keywords: Thermal Insulation / Thermal Conductivity / Foam Sheet / Gas Barrier |
| Top of the Page▲ |
| Front-Line Polymer Science |
| Block Copolymer Template Engineering | Tomokazu IYODA and Ryoko WATANABE |
| <Abstract>A new wave is surging on a long history of microphase-separated nanostructures
in block copolymers as the self-assembled nanostructures leading to industrial
use as the new engineered plastics. Emphasis should be placed on both high
reproducibility and mass production of these ordered nanostructures through
self-assembling nanofabrication processes, expected as one of the powerful
counterparts of the top-down-type nanofabrication such as lithography and
beam processing. Here, recent progress of block copolymer lithography including
dry etching process toward the next generation semiconductor process is
briefly reviewed. Our approach based on total wet process using amphiphilic
liquid crystalline block copolymer films equipped with fully penetrated
transport channels is also introduced. Keywords: Block Copolymer / Lithography / Nanopatterning / Bottom-up Technology / Microphase Separation / Template / Self-assembly / Ordered Nanostructures |
| Top of the Page▲ |
| Copyright(C) 2010 The Society of Polymer Science, Japan All Rights Reserved. |