POLYMERS Vol.59　No.2 February 2010
POLYMERS　Vol.59　No.2
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COVER STORY
Thermal Management Polymer
Growing Polymers: A Personal Account
The Departure of a Self-Supporting Young Researcher’s Ship Atsuhiro FUJIMORI
<Abstract>I became independent to form my own laboratory. I have always practiced hard to improve my skill with the aim of becoming a professional of structural analysis for the polymer Langmuir-Blodgett films since then.
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Purpose and Means Hiroyasu MASUNAGA
<Abstract>I think it is good that I achieve my mission in academic research activities even if the purpose and means change.
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COVER STORY: Highlight Reviews
Determination of Thermal Conductivity and Thermal Diffusivity of Polymeric Materials: the Methods and the Standards Toshimasa HASHIMOTO and Junko MORIKAWA
<Abstract>This review provides a broad overview of the methods for the determination of thermal conductivity and thermal diffusivity of polymeric materials. Different techniques are available for these measurements and some may be better suited than others for a particular type, state and form of material.
ISO (the International Organization for Standardization) is a worldwide federation of national standards bodies. Draft International Standards adopted by the technical committees are circulated to the member bodies for voting. ISO22007, “Plastics - Determination of thermal conductivity and thermal diffusivity”, has been issued by a majority of votes in ISO/TC61, a technical committee for the plastic industry.
The results of round robin testing of poly(methylmethacrylate) give the information on the sample geometry and the suitable methods. Thermal diffusivity of aromatic polyimide thin films is examined in relation with the number of phenylene units in dianhydride by using the temperature wave analysis.
Keywords: Thermal Conductivity / Thermal Diffusivity / Temperature Wave Analysis / Aromatic Polyimide / Poly (methylmethacrylate) / ISO
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High Thermal Conductive Polymer Prepared in a Magnetic Field Tohru KIMURA, Naoyuki SHIMOYAMA, and Hisashi AOKI
<Abstract>As a result of the development of recent superconductive technology, a high magnetic field can be easily utilized, and the behavior of diamagnetic material and paramagnetic material in a high magnetic field are actively studied. It is known that the thermotropic liquid crystalline polymer is oriented in the magnetic field. The oriented polymer has high thermal conductivity and low coefficient of linear expansion in the direction of a magnetic field. It reaches 8 times higher thermal conductivity than a conventional polymer. It is also possible to align the network structure of liquid crystalline epoxy resin by a high magnetic field. The curing epoxy resin has various anisotropic properties under a magnetic field. We succeeded in improving the thermal conductivity over 10W/m・K at certain plastic film using a high magnetic field.
Keywords: Thermal Conductivity / Magnetic Field / Anisotropic / Liquid Crystalline Polymer
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High Thermal Conductive Epoxy Resin with Controlled Higher Order Structures Yoshitaka TAKEZAWA
<Abstract> We developed novel epoxy resins with increased thermal conductivity that has been a barrier to heat dissipation. The medium of thermal conduction for insulating resins is phonons. Phonon conduction depends on the crystallinity, since it is a lattice vibration. The scattering of phonons happens at the interface of an amorphous structure. If there is a macroscopic amorphous structure despite the existence of crystal structure on the microscopic level, we expected that high thermal conduction could be attained by reduced scattering of phonons through controlling the nano scale structure. Using an epoxy resin which has the mesogen structure would solve this problem because it's easy to carry out an orientation with this structure. As a result, we confirmed that thermal conductivities get larger when the amounts of mesogens were increased. The conductivity of the developed epoxy resin was about five times higher than that of the conventional epoxy resin.
Keywords: Epoxy Resin / Thermal Conductivity / Mesogen / Phonon / Orientation / Domain / Insulation
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COVER STORY: Topics and Products
Development of New Thermal Conductivity Measurement Systems Satoshi ENDO
<Abstract>Ulvac-Riko, Inc. has developed new thermal conductivity measurement systems based on various kinds of steady method, temperature wave analysis method, flash method, scanning laser heating AC method, periodic heating thermoreflectance method, and so on. Here, we introduce new thermal conductivity and diffusivity meters made by Ulvac-Riko, Inc.
Keywords: Thermal Conductivity / Thermal Diffusivity / Steady Method / Flash Method / Temperature Wave Method / Scanning Laser Heating AC Method / Periodic Heating Thermoreflectance Method
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High Heat Conductive Milled Carbon Fiber “Raheama” and Its Application Hiroki SANO
<Abstract>“Raheama” is a highly graphitized carbon fiber. “Raheama” has two features for the heat conductive compound design. One is high heat conductivity, another is suitable shape for forming thermal transport channels.
Keywords: Heat Conductivity / Carbon Fiber / Graphite
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RICO-Zima-inus, Thermally Conductive and Electrically Insulating Epoxy Resin Compound Noriyuki KOZAKAI, Tetsuya SHIRAISHI, and Takeshi NISHIHATA
<Abstract>RICO-Zima-inus is the one package epoxy resin compound with high thermal conductivity and electric insulation. The thermal conductivity is up to 40 times higher (=1～7.3 W/Km) than an ordinary epoxy resin, even though electronic insulating is kept. This compound includes the group of unique inorganic mineral particles in order to compose a thermal conductive structure.
Keywords: Epoxy Resin / Heat Conductivity / Electric Insulation / Inorganic Particle
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Heat Dissipating Molding Compounds SUMIKON® Kazuya KITAGAWA
<Abstract>“SUMIKON® ” thermoplastic/thermoset molding compounds with heat dissipating characteristics are introduced. Heat dissipation of component part molded from SUMIKON® is also shown to be effective in heat decrease for various devices.
Keywords: Heat Dissipation / Resin Molding Compound / Thermoset / Thermoplastic / Phenolic Resin / Polyphenylenesulfide
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Phase Change Sheet Type Thermally Conductive Spacer Toshitaka YAMAGATA
<Abstract>A phase change sheet type high thermally conductive spacer, PCA-E5, was developed. The value of thermal conductivity was increased from 3.0 W/mK to 3.8 W/mK with a small size thermally conductive filler and a high flow matrix resin.
Keywords: Phase Change Sheet / Thermal Conductivity
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New Non-Silicone Type Thermally Conductive RTV (Room Temperature Vulcanizing) Elastomers Hideki KAWAI
<Abstract>New Non-Silicone type Thermally Conductive RTV elastomers have been developed.
These new RTV elastomers consist of Kaneka original non-silicone type reactive oligomers and thermally conductive fillers. These new elastomers show high thermal conductivity and electrical resistivity. They are curable by moisture in the atmosphere at room temperature.
Keywords: Non-Silicone RTV Elastomer / Thermal Conductivity / Thermal Interface Material
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Eco-Friendly Thermal Insulating Foam Sheet Masanori SUEOKA
<Abstract>We have developed Non-Freon thermal insulating foam sheet with excellent insulation properties and durability by combining of innovative foaming technology and gas barrier technology. According to our simulation, it can maintain thermal conductivity of 0.023 W/mK over 20 years.
Keywords: Thermal Insulation / Thermal Conductivity / Foam Sheet / Gas Barrier
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Front-Line Polymer Science
Block Copolymer Template Engineering Tomokazu IYODA and Ryoko WATANABE
<Abstract>A new wave is surging on a long history of microphase-separated nanostructures in block copolymers as the self-assembled nanostructures leading to industrial use as the new engineered plastics. Emphasis should be placed on both high reproducibility and mass production of these ordered nanostructures through self-assembling nanofabrication processes, expected as one of the powerful counterparts of the top-down-type nanofabrication such as lithography and beam processing. Here, recent progress of block copolymer lithography including dry etching process toward the next generation semiconductor process is briefly reviewed. Our approach based on total wet process using amphiphilic liquid crystalline block copolymer films equipped with fully penetrated transport channels is also introduced.
Keywords: Block Copolymer / Lithography / Nanopatterning / Bottom-up Technology / Microphase Separation / Template / Self-assembly / Ordered Nanostructures
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