POLYMERS Vol.60　No.3 March 2011

POLYMERS　Vol.60　No.3

COVER STORY
Polymers Pushing the Limits of Semiconductors

The progress of highly integrated and high-speed semiconductor circuits has been following Moore’s law, by which the number of components in an integrated circuit doubles every two years. This has been achieved not only through the progress of silicon transistor design but also thanks to the development of polymers which play an important role in realizing the desired performance. This issue focuses on polymeric materials used for next-generation electronic device fabrication and introduces the latest technology.

（Editors: MIKOSHIBA, SEKI, NAKAGAWA, and VACHA）

Hot Topics

115

Commentary

Expectation of Polymer Materials Innovation

Hisatsune WATANABE

117

COVER STORY: Highlight Reviews

Photoresists for Microlithography	Mitsuru UEDA	118
Development of Extreme Ultraviolet Resist Materials	Hiroto KUDO and Tadatomi NISHIKUBO	122
Directed Self-Assembly of Block Copolymers for Lithographic Applications	Hiroshi YOSHIDA	126
UV Nanoimprint	Hiroshi HIROSHIMA	130

Glossary for Highlight Reviews

134

COVER STORY:Topics and Products

Resist Materials for ArF Immersion Lithography	Koji NOZAKI	135
Progress of Mask-Blanks and Nanoimprint Mold Development for Hard Disk Drive Application	Tsuyoshi WATANABE and Osamu NAGAREKAWA	137
Fluorescent Resist Materials for Nanoimprint Lithography	Masaru NAKAGAWA	139
Electron Beam Resists	Takumi UENO	141
Recent Topics in Resist Development Used for Extreme Ultraviolet Lithography	Takahiro KOZAWA	143

Growing Polymers: A Personal Account

Enjoy Conferences !	Akihiro KISHIMURA	145
Personal Connections Lead to a Treasure Trove of Researches	Keita KUROIWA	146

Messages: “Work and Life”

What Do We Work for ?

Tsuneaki TANABE

147

Front-Line Polymer Science

Polymer Structure and Physical Properties at Non-Solvent Interfaces

Keiji TANAKA and Yoshihisa FUJII

148

Messages from SPSJ

153

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